Wholesale Manual Wire Bonding Machine | Available at JXL Factories for Quality Solutions
The Manual Wire Bonding Machine from Chengdu JuXinLi Technology Co., Ltd. is a precision-engineered tool designed for wire bonding in the semiconductor and microelectronics sectors. It accommodates various wire types, including gold, aluminum, and copper, ensuring exceptional accuracy and dependability. Key features include adjustable bond force and bond time, providing flexibility to customize bonding processes to specific needs. Its user-friendly design allows for operational ease and minimizes fatigue during extended use. Built to endure the rigors of continuous production, this machine guarantees consistent bonding performance, making it an ideal choice for prototyping, small-scale production, and research and development of electronic devices.
