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Achieve precise and efficient wire bonding with the Manual Wire Bonder from Chengdu JuXinLi Technology Co., Ltd. This high-quality bonding tool is designed for diverse applications in the semiconductor and microelectronics industry. Featuring advanced control and monitoring systems, the Manual Wire Bonder ensures accurate and reliable results. Its compact design and user-friendly interface make it easy for operators to master the bonding process and maintain consistency. With capabilities for ball bonding, wedge bonding, and deep access bonding, this versatile tool is ideal for R&D labs, small-scale production facilities, and educational institutions. Chengdu JuXinLi Technology Co., Ltd. is dedicated to providing innovative and dependable solutions to enhance your wire bonding operations and achieve outstanding results.