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Large Wire Bonding Wedges By JXL

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Large Aluminum Wedge Bonding Wire

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01
Silver Based Bonding Wire
Silver Based Bonding Wire

Silver Based Bonding Wire

Introducing JXL Silver Based Bonding Wire In the ever-evolving electronic market, there is a persistent demand for cost efficiencies. A noticeable trend involves exploring bonding wire alternatives to gold in order to reduce production overheads. However, the choice of material is crucial and must be tailored to specific application needs.

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    Features

    If you currently use bonding wires from other renowned brands, rest assured that switching to our products will not require any process changes. We are highly confident in the quality of our bonding wires. Please don’t hesitate to reach out to us for further information.

    For instance, in instances where delicate or slim bond pads are present, copper wires may pose a risk of damaging the chip during the bonding process. In such scenarios, the softness and cost-effectiveness of silver make it a compelling alternative to gold.

    At JXL, we boast an extensive portfolio of silver-based bonding wires carefully crafted to suit a diverse range of applications and specifications. Our wires predominantly consist of silver (approximately 89-99%) along with alloy elements and dopants precisely formulated to meet the required configuration. 

    Rigorous testing methods validate the suitability of our silver based bonding wires for various applications, including extended reliability testing under temperate cycling and high-temperature conditions, as well as Highly Accelerated Stress Testing (HAST).Choosing the optimal solution for your specific needs can be complex, which is why our experienced specialists are on hand to provide technical expertise and application know-how. 

    We offer on-site support for evaluation and qualification, particularly when dealing with intricate issues and configurations. Furthermore, our application and technology center allows us to conduct tests directly within the application, providing you with valuable insights and saving both time and money. Partner with JXL, a trusted ally, and expedite your development process.
    • gold-bonding-wire-factory-manufactureri3p
    • Silver Based Bonding Wireo6q

    ● Characteristics

    Type

    YA1

    YA2

    YA3

    YA4

    Main content

    Ag≥99.0%

    AuPd≤1.0%

    Ag≥95.0%

    AuPd≤5.0%

    Ag≥88.0%

    AuPd≤12.0%

    Ag≥85.0%

    AuPd≤15.0%

    Characteristics

    low electrical resistivity
    high thermal conductivity

    good fatigue resistance

    good corrosion resistance


    high reliability


    ● Mechanical properties

    Diameter

    B/L(gf)

    E/L(%)

    μm

    mil

    YA1

    YA2

    YA3

    YA4

    YA

    15±1

    0.6

    ＞1.5

    ＞2

    ＞3

    ＞4

    2 - 10

    16±1

    0.65

    ＞2

    ＞3

    ＞4

    ＞5

    2 - 10

    18±1

    0.7

    ＞4

    ＞5

    ＞6

    ＞7

    5 - 15

    20±1

    0.8

    ＞5

    ＞6

    ＞7

    ＞8

    5 - 15

    23±1

    0.9

    ＞7

    ＞8

    ＞10

    ＞11

    5- 15

    25±1

    1.0

    ＞9

    ＞10

    ＞12

    ＞13

    5- 15

    30±1

    1.2

    ＞13

    ＞14

    ＞15

    ＞16

    8- 18

    32±1

    1.25

    ＞15

    ＞16

    ＞17

    ＞18

    8 - 18

    38±1

    1.5

    ＞20

    ＞21

    ＞22

    ＞23

    10 - 20

    50±2

    2.0

    ＞34

    ＞36

    ＞38

    ＞40

    10 - 20

    75±3

    3.0

    ＞68

    ＞70

    ＞75

    ＞78

    15 - 25


    ● Applications Of Ag Bonding Wires

    YA1

    YA2

    YA3

    YA4


    Common

    LED
    TR
    IC CARD

    QFN

    TSOP

    Flash Memo

     

    LED

    PBGA

    QFP

    TQFP

    TSSOP

    BGA

    QFN

    Flash Memo

    DFN

     

    IC CARD

     

    MQFP

     

     

    TQFP
    TSSOP
    PBGA
    BGA


    ● Fusing Current & Hardnes

    Type

    YA1

    YA2

    YA3

    YA4

     

    μm

    mil

    Fusing Current
    (A,10mm)

    18

    0.7

    0.38

    0.35

    0.32

    0.30

    20

    0.8

    0.49

    0.45

    0.42

    0.39

    23

    0.9

    0.62

    0.57

    0.53

    0.48

    25

    1.0

    0.76

    0.70

    0.64

    0.61

    30

    1.2

    1.07

    0.99

    0.91

    0.89

    38

    1.5

    1.66

    1.54

    1.42

    1.37

    50

    2.0

    2.91

    2.74

    2.52

    2.43

    Hardness
    (Hv)

    Wire

    56-61

    59-64

    61-66

    63-68

    FAB

    50-55

    53-58

    55-59

    56-60

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