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Gold Bonding Wire

-99.99% pure gold bonding wire (with other options available)

-Created using high-purity vacuum processing with highly refined metals

-Available in diameters ranging from 12.5µm (0.0005’) to 125µm (0.005’)

-Consistent elongation and tensile strength throughout the entire spool

-Suitable for both manual and automatic wire bonding equipment

-Manufacturing process controls guarantee improved looping performance

    Features

    If you currently use bonding wires from other renowned brands, rest assured that switching to our products will not require any process changes. We are highly confident in the quality of our bonding wires. Please don’t hesitate to reach out to us for further information.

    JXL specializes in producing exceptionally pure (up to 99.99%) gold bonding wire for ball bonding and wedge bonding applications. Our in-house processes including casting, drawing, rolling, annealing, and comprehensive analytical capabilities, guarantee a final product that is consistently uniform with exceptionally clean surfaces and a polished finish.

    We offer a wide range of gold bonding wire diameters, from 12.5µm (0.0005") to 125µm (0.005"), all tailored to meet customer specifications for strength, hardness, and elongation in various applications.

    Our high-purity gold bonding wire is vacuum-processed from meticulously refined metals and is available on a diverse selection of spool types, suitable for use with all wire bonding equipment models. Applications for our gold wire include the interconnection of semiconductor devices, wafer bumping, stud bump, and interconnection of other microelectronic and related assemblies.

    With strictly controlled doping processes, JXL has built a strong reputation for delivering custom wire properties tailored to specialized applications using automated wire bonders. Our gold bonding wire is also supplied for use with manual equipment.

    Mechanical Properties

    Diameter

    B/L(gf)

    E/L(%)

    μm

    mil

    YG1

    YG5

    YG9/YG10

    YG

    16±1

    0.65

    >2.0

    >3.0

    >4.0

    2.0-5.0

    18±1

    0.7

    >2.5

    >4.0

    >5.0

    2.0-5.0

    19±1

    0.75

    >3.0

    >4.5

    >5.5

    2.0-6.0

    20±1

    0.8

    >3.0

    >5.0

    >6.0

    2.0-6.0

    23±1

    0.9

    >5.0

    >7.0

    >8.0

    2.0-7.0

    25±1

    1.0

    >7.0

    >9.0

    >10.0

    2.0-8.0

    30±1

    1.2

    >10.0

    >13.0

    >15.0

    3.0-8.0

    33±1

    1.3

    >13.0

    >16.0

    >18.0

    3.0-8.0

    38±1

    1.5

    >17.0

    >21.0

    >26.0

    3.0-10.0

    50±2

    2.0

    >30.0

    >35.0

    >37.0

    3.0-12.0


    Fusing Current&Hardness

    Type

    YG1

    YG5

    YG9

    YG10

     

    μm

    mil

    Fusing current

    (A,10mm)

    16

    0.65

    0.34

    0.31

    0.22

    0.20

    18

    0.70

    0.38

    0.35

    0.26

    0.25

    20

    0.80

    0.42

    0.39

    0.28

    0.28

    23

    0.90

    0.49

    0.46

    0.32

    0.31

    25

    1.00

    0.53

    0.50

    0.35

    0.35

    30

    1.20

    0.63

    0.60

    0.42

    0.41

    33

    1.30

    0.70

    0.67

    0.46

    0.44

    38

    1.50

    0.80

    0.77

    0.53

    0.51

    50

    2.00

    1.06

    1.04

    0.70

    0.68 

    Hardness

    (Hv)

    Wire

    54-58

    58-62

    67-71

    70-74

    FAB

    44-48

    48-52

    57-61

    60-64

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