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Copper Bonding Wire

Copper Bonding Wire Innovation

As electronic devices continue to advance, the demand for smaller, more intricate components has grown exponentially. This progression has given rise to the need for cost-effective solutions that maintain high levels of reliability. Among these solutions, copper bonding wires have emerged as a sophisticated alternative to traditional gold wires.

    Features

    If you currently use bonding wires from other renowned brands, rest assured that switching to our products will not require any process changes. We are highly confident in the quality of our bonding wires. Please don’t hesitate to reach out to us for further information.

    JXL's copper bonding wires offer a compelling substitute for expensive gold-based solutions. Their ultra-fine diameters (0.6 mils or 15 µm) make them well-suited for use in very small structures with ultra-fine pitch. The addition of alloy elements to the bare Cu wire or the utilization of CuPd/AFPC core Cu wire results in enhanced reliability and exceptional bondability. 

    In numerous applications, copper wire bonding exhibits superior performance and reliability compared to gold wire bonding.Additionally, copper bonding wires are exceptionally suitable for ball/wedge bonding processes when utilizing a reduced protective gas atmosphere. They can also be processed in wedge/wedge bonding procedures.

    Discover your optimal solution within our wide range of products, including PdFlash, PdSoft, PdPro, DHF & iCu, and MaxSoft. Benefit from the support of JXL specialists with extensive experience, who provide technical expertise and application know-how. Our on-site assistance includes evaluation, especially for complex issues and configurations. Furthermore, our application and technology center enables us to conduct tests on your adaptations directly within the application, ultimately saving you time and money. Partner with JXL as your qualified ally and expedite your development process.

    YC1:4N high purity copper wire, low hardness, good balling performance.

    YC2:3N flexible copper wire with good corrosion resistance.

    YC3:2N alloy copper wire has good fatigue resistance and high reliability.

    YC4:1N5 alloy copper wire has good oxidation resistance and high reliability.
    Mechanical Properties

    Diameter

    B/L(gf)

    E/L(%)

    μm

    mil

    YC1

    YC2

    YC3

    YC4

    YC1/YC2

    YC3/YC4

    15±1

    0.6

    >3

    >3

    >3

    >3

    8-16

    8-16

    18±1

    0.7

    >3

    >3

    >4

    >4

    8-16

    8-16

    20±1

    0.8

    >4

    >4

    >5

    >5

    8-16

    10-18

    23±1

    0.9

    >5

    >5

    >7

    >7

    8-16

    10-18

    25±1

    1.0

    >6

    >6

    >8

    >8

    8-16

    10-18

    30±1

    1.2

    >10

    >10

    >13

    >13

    10-18

    12-20

    38±1

    1.5

    >20

    >20

    >22

    >22

    12-20

    14-22

    40±1

    1.6

    >25

    >25

    >27

    >27

    12-20

    14-22

    50±2

    2.0

    >38

    >38

    >42

    >42

    12-20

    14-22


    Fusing Current&Hardness

    Type

    YC1

    YC2

    YC3

    YC4

     

    μm

    mil

    Fusing current

    (A,10mm)

    18

    0.70

    0.19

    0.32

    0.26

    0.50

    20

    0.80

    0.23

    0.36

    0.30

    0.53

    23

    0.90

    0.28

    0.41

    0.35

    0.58

    25

    1.00

    0.32

    0.45

    0.39

    0.62

    30

    1.20

    0.42

    0.55

    0.49

    0.72

    38

    1.50

    0.59

    0.72

    0.66

    0.89

    50

    2.00

    0.89

    1.02

    0.96

    1.19

    Hardness

    (Hv)

    Wire

    56-60

    58-62

    68-72

    81-85

    FAB

    46-50

    48-52

    58-62

    71-75


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